Dell 3100 Especificaciones Pagina 117
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- SOLUCIÓN DE PROBLEMAS
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Valorado. / 5. Basado en revisión del cliente
Cantilever Preparation
Silicon Nitride Cantilever Substrates
Rev. D Dimension 3100 Manual 97/(96 Blank)
Figure 6.2d Silicon Nitride Cantilevers (profile)
There are two types of silicon nitride cantilever probes available: standard and oxide-sharpened tip
processes. The standard devices have the nitride deposited directly into the etched silicon mold pit
formed by the intersecting <111> planes, and have points that are slightly rounded with respect to
the tips produced using the oxidation sharpening process.
The oxide-sharpened silicon nitride probes have a thermally grown silicon dioxide film deposited in
the mold pit used to shape the nitride tip, prior to silicon nitride film deposition. The oxide has two
effects: it shapes the inner contours of the pyramidal pit so that a slight cusp forms at the point of
the pyramid, and the oxide protects the tip from excessive exposure to a long duration wet silicon
etch used to free the cantilevers from the silicon substrate. The result is a noticeably sharper point at
the end of the pyramid. Regrettably, along with the increased sharpness of the tip comes a slight
increase in double tip effect experienced with the oxide sharpened process.
65.0°
Scanning Profile
45.0°
10.0°
- Dimension 3100 Manual 1
- Ta ble of Contents 3
- List of Figures 13
- Chapter 1 System Overview 21
- 1.1 System Overview 22
- 1.2 Control Station Overview 23
- 1.2.2 Computer 24
- Control Station Overview 25
- Dimension 3100 SPM Overview 27
- 1.3.3 Stage System 29
- 1.3.4 Dimension SPM Head 29
- 1.3.5 Cantilever Holder 33
- 1.3.6 Video Zoom Microscope 34
- Sample Size & Handling 35
- 1.5 Facilities Specifications 36
- 1.6 Applications 36
- Chapter 2 Safety 37
- 2.1 Safety Requirements 39
- 2.2 Safety Precautions 40
- Safety Precautions 41
- 2.2.2 Microscope 43
- 2.3 Ergonomics 46
- 2.4 Environmental Conditions 47
- 2.6.1 Pre Power-up Checklist 48
- Connections 49
- Final Installation 50
- Power-up (Installation Only) 51
- 2.8 Software Power-up 52
- 2.8.2 Log On 53
- 2.8.4 Select Realtime 54
- 2.9 Hazard Labels 55
- 2.9.1 Laser Warning Labels 56
- 3.1 Optional Configurations 58
- 3.1.2 VT-102 59
- 3.1.3 IS3K-2 60
- 3.2 Facilities Requirements 61
- External Vacuum 62
- Supply Module 62
- Facilities Requirements 63
- Top View 66
- Side and Front View 66
- Front View 67
- 3.3.5 ELCON Console 68
- 1959-940-A 70
- General Facilities Guidelines 71
- Chapter 4 Installation 73
- 4.1 Shipping and Receiving 74
- Shipping and Receiving 75
- 4.2 Uncrating the System 76
- Chuck Base 78
- Keyboard MouseTrackball 79
- Installation 81
- OK twice 82
- NanoScope® IIIa 83
- NanoScope® 85
- 4.5 System Power-up 88
- Chapter 5 Stage System 89
- 5.1 Mounting of Samples 90
- Mounting of Samples 91
- 5.2 Stage Menu Commands 92
- 5.2.2 Locate Tip 93
- 5.2.3 Focus Surface 94
- 5.2.4 Move To (X,Y) 96
- 5.2.5 Set Reference 97
- Set Reference 98
- X Axis Y AxisOrigin ResetQuit 98
- 5.2.6 Programmed Move 99
- Stage Menu Commands 102
- 5.2.7 Initialize 103
- 5.2.8 SPM Parameters 105
- 6.1.1 Wafer Tool Kit 108
- 6.1.2 Cantilever Preparation 108
- Silicon Cantilever Substrates 109
- Press here to break out strip 113
- Lever Type 116
- Scanning Profile 117
- Preparation 119
- 7.1 System Information 120
- 7.1.3 Laser Requirements 121
- 7.2 Basic AFM Operation 122
- Basic AFM Operation 123
- 7.2.9 Align Laser 126
- 7.2.10 Adjust Photodetector 131
- 7.2.11 Locate Tip 133
- 7.2.12 Load the Sample 134
- 7.2.13 Focus Surface 135
- 7.3 Advanced AFM Operation 137
- Advanced AFM Operation 138
- Chapter 8 Contact AFM 139
- 8.1.1 Select the Microscope 140
- 8.1.4 Align Laser 140
- 8.1.5 Adjust Photodetector 141
- 8.1.6 Locate Tip 141
- 8.1.7 Focus Surface 141
- 8.1.8 Show All Items 142
- 8.1.10 Engage 145
- 8.2.1 Cantilever Selection 145
- Approach 146
- Jump to contact 146
- Adhesion 146
- Pull-off 146
- 8.3.1 Data Type 147
- 8.3.2 Gain Settings 148
- 8.3.3 Scan Size and Scan Rate 149
- 8.3.4 Setpoint 149
- 8.3.5 Lowpass Filter 149
- 8.3.6 Highpass Filter 149
- 8.4 Force Calibration Mode 150
- Chapter 9 TappingMode AFM 151
- 9.1 Principles of TappingMode 152
- Return signal 153
- (deflected) 153
- Laser beam 153
- Sample surface 153
- 9.2.3 Align Laser 154
- 9.2.4 Adjust Photodetector 154
- 9.2.5 Locate Tip 154
- 9.2.6 Focus Surface 155
- 9.2.7 Cantilever Tune 155
- Frequency Sweep 158
- 9.2.8 Show All Items 159
- 9.2.10 Engage 161
- 9.3 Withdraw the Tip 162
- 9.4.1 Resonating Techniques 163
- 9.4.2 Cantilever Oscillation 163
- 50.00 nm/div 164
- Scan Size - 2.50 µm/div 164
- Drive Frequency 165
- 9.4.5 Data Type 166
- 9.4.6 Gain Settings 166
- 9.4.8 Surface Tune 167
- 9.5 Troubleshooting 168
- Chapter 10 Fluid Imaging 169
- 10.1 Basic Principles 171
- 10.2 Fluid Operation Hardware 171
- 10.2.2 Tip Suggestions 172
- 10.3 Sample Mounting 173
- 10.3.2 Larger Samples 174
- 10.3.3 Smaller Samples 174
- 10.4 Precautions 175
- Precautions 176
- 10.5 Operating Principles 177
- Operating Principles 178
- 10.5.6 Align Laser 179
- 10.5.7 “False” Reflections 180
- 10.5.8 Load Sample 180
- 10.5.9 Lower Probe into Fluid 182
- 10.5.11 Adjust Photodetector 182
- 10.5.12 Locate Tip 183
- 10.5.13 Focus Surface 183
- 10.5.15 Show All Items 189
- 10.5.17 Engage 191
- 10.6 Troubleshooting 193
- Troubleshooting 194
- Microscopy (STM) 195
- 11.1 Introduction 196
- 11.2 Basic STM Operation 197
- Basic STM Operation 198
- parameters 200
- 11.3.1 STM Hardware 201
- 11.3.3 STM Operating Modes 202
- Sensitivity (Å/V) 206
- 11.4.1 Operation of STS 207
- 11.6 Etching Tungsten Tips 212
- Etching Tungsten Tips 213
- 12.1 Introduction 215
- 12.2 Basic LFM Operation 216
- 12.3 Advanced LFM Operation 217
- 12.3.2 Tip selection 218
- High Friction 219
- Low Friction 219
- Advanced LFM Operation 220
- Chapter 13 Force Imaging 223
- 13.1 Force Plots–An Analogy 224
- Force Plots–An Analogy 225
- 13.2 Force Calibration Mode 226
- Force Calibration Mode 227
- 13.2.1 Example Force Plot 229
- Y Offset 233
- 13.3.3 Channel 1, 2, 3 Panels 235
- Total Force 237
- End Mode 238
- 13.3.6 Menu Bar Commands 239
- Piezo travel 240
- Position 240
- 13.4.2 Helpful Suggestions 242
- 13.4.3 Advanced Techniques 243
- 13.5.1 Force Plots 248
- 13.5.3 High Contact Force 252
- 13.5.4 Tip Selection 252
- 13.6 Force Modulation 253
- Force Modulation 254
- 13.6.3 Operating Principle 255
- 13.6.5 Notes About Artifacts 261
- 13.8 Force Volume 265
- Interleave Mode Description 269
- 14.3 LiftMode Description 270
- 14.5.2 Setpoint Selection 272
- Magnetic Force Microscopy 276
- 15.2 Basic MFM Operation 278
- Basic MFM Operation 279
- 15.3 Advanced MFM Operation 284
- 15.3.3 Drive Amplitude 285
- Advanced MFM Operation 286
- 15.4.1 Phase Extender Module 288
- 15.4.2 Quadrex Extender 289
- 15.4.3 NanoScope IV 289
- 15.6 Troubleshooting 290
- Electric Techniques Overview 293
- Electric Force Microscopy 295
- NanoScope 299
- 16.2.4 Phase Detection 311
- 16.2.5 Frequency Modulation 313
- 16.2.6 Amplitude Detection 313
- EFM Troubleshooting/Pointers 315
- 16.3.8 Try Uncoated Si Tip 316
- Chapter 17 Calibration 325
- Section 17.8.6 326
- 17.1 SPM Calibration Overview 327
- SPM Calibration Overview 329
- 17.2 Calibration Setup 332
- Scan Angle = 0° 333
- 17.2.4 Set Up Contact AFM 334
- 17.3.1 Measure Orthogonality 334
- Check Sample Orthogonality 335
- 17.4 Linearity Correction 336
- Linearity Correction 337
- 17.4.2 Adjust Fast mag1 339
- 17.4.3 Adjust Slow mag1 340
- Autocalibration 341
- SKIP to 342
- 17.6 Autocalibration 343
- Draw a horizontal line 347
- 17.8 Calibrating Z 351
- Calibrating Z 352
- 17.8.4 Correct Z Sensitivity 355
- 18.1 Maintenance 358
- Maintenance 359
- 18.1.2 Calibration 360
- 18.1.5 Air Tables 364
- 18.1.6 Air Pressure 364
- 18.1.7 Air Table Feet 364
- 18.1.8 Optics Zoom System 365
- 18.2 Troubleshooting 366
- 18.2.2 Common Problems 368
- 18.3 Warranty 369
- Warranty 370
- 136, 167 374
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