4. Press down and out on the ejectors on each end of the socket until the memory module pops out of the socket. See Figure3-12.
Handle each memory module only on either card edge, ensuring not to touch the middle of the memory module.
5. Replace the memory cooling shroud. See Replacing the Memory Cooling Shroud.
6. Close the system. See Opening and Closing the System.
Activating the Integrated NIC TOE
ToaddTCP/IPOffloadEngine(TOE)functionalitytothesystem'sintegratedNIC,installtheTOENIChardwarekeyintheTOE_KEYsocketonthesystemboard
(see Figure6-2.)
Processors
You can upgrade your processor(s) to take advantage of future options in speed and functionality. Each processor and its associated internal cache memory
are contained in a land grid array (LGA) package that is installed in a ZIF socket on the system board.
The following items are included in the processor upgrade kit:
l Processor
l Heat sink
Removing the Processor
1. Prior to upgrading your system, download the latest system BIOS version on support.dell.com.
2. Turnoffthesystem,includinganyattachedperipherals,anddisconnectthesystemfromtheelectricaloutlet.
3. Open the system. See Opening and Closing the System.
4. Remove the memory cooling shroud. See Removing the Memory Cooling Shroud.
5. Press the blue tab on the end of one of the heat-sink retention levers to disengage the lever, then lift the lever 90 degrees. See Figure3-13.
Figure 3-13. Installing and Removing the Heat Sink
CAUTION: Only trained service technicians are authorized to remove the system cover and access any of the components inside the system. See
your Product Information Guide for complete information about safety precautions, working inside the computer, and protecting against
electrostatic discharge.
NOTICE: When you remove the heat sink, the possibility exists that the processor might adhere to the heat sink and be removed from the
socket. It is recommended that you remove the heat sink while the processor is warm.
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